Making a ‘sandwich’ out of magnets and topological insulators, potential for lossless electronics

Journal Reference: Qile Li, Chi Xuan Trang, Weikang Wu, Jinwoong Hwang, David Cortie, Nikhil Medhekar, Sung‐Kwan Mo, Shengyuan A. Yang, Mark T. Edmonds. Large Magnetic Gap in a Designer Ferromagnet–Topological Insulator–Ferromagnet Heterostructure. Advanced Materials, 2022; 2107520 DOI: 10.1002/adma.202107520 Such a heterostructure provides an avenue towards viable ultra-low energy future electronics, or even topological photovoltaics. Topological … Read more

Quantum physics sets a speed limit to electronics

Journal Reference: M. Ossiander, K. Golyari, K. Scharl, L. Lehnert, F. Siegrist, J. P. Bürger, D. Zimin, J. A. Gessner, M. Weidman, I. Floss, V. Smejkal, S. Donsa, C. Lemell, F. Libisch, N. Karpowicz, J. Burgdörfer, F. Krausz, M. Schultze. The speed limit of optoelectronics. Nature Communications, 2022; 13 (1) DOI: 10.1038/s41467-022-29252-1 How fast can … Read more

New Fermi arcs could provide a new path for electronics

Journal Reference: Benjamin Schrunk, Yevhen Kushnirenko, Brinda Kuthanazhi, Junyeong Ahn, Lin-Lin Wang, Evan O’Leary, Kyungchan Lee, Andrew Eaton, Alexander Fedorov, Rui Lou, Vladimir Voroshnin, Oliver J. Clark, Jamie Sánchez-Barriga, Sergey L. Bud’ko, Robert-Jan Slager, Paul C. Canfield, Adam Kaminski. Emergence of Fermi arcs due to magnetic splitting in an antiferromagnet. Nature, 2022; 603 (7902): 610 … Read more

French start-ups bring green to the Consumer Electronics Show in Las Vegas

French start ups bring green to the Consumer Electronics Show in

Naïo Technologies’ autonomous electric robot, dedicated to agriculture, at the Consumer Electronics Show in Las Vegas, Monday, January 3. ELLEN SCHMIDT / AP French start-ups devoted to agritech or greentech return with a harvest of trophies from the Consumer Electronics Show (CES) in Las Vegas, the world’s largest trade fair for technological innovation, which was … Read more

Fabrication of flexible electronics improved using gold and water-vapor plasma

Journal Reference: Masahito Takakuwa, Kenjiro Fukuda, Tomoyuki Yokota, Daishi Inoue, Daisuke Hashizume, Shinjiro Umezu, Takao Someya. Direct gold bonding for flexible integrated electronics. Science Advances, 2021; 7 (52) DOI: 10.1126/sciadv.abl6228 As electronic devices get smaller and smaller, and the desire to have bendable, wearable, and on-skin electronics increases, conventional methods of constructing these devices have … Read more

A new platform for controlled design of printed electronics with 2D materials

Journal Reference: Erik Piatti, Adrees Arbab, Francesco Galanti, Tian Carey, Luca Anzi, Dahnan Spurling, Ahin Roy, Ainur Zhussupbekova, Kishan A. Patel, Jong M. Kim, Dario Daghero, Roman Sordan, Valeria Nicolosi, Renato S. Gonnelli, Felice Torrisi. Charge transport mechanisms in inkjet-printed thin-film transistors based on two-dimensional materials. Nature Electronics, 2021; 4 (12): 893 DOI: 10.1038/s41928-021-00684-9 A … Read more

Researchers develop new measurements for designing cooler electronics

Journal Reference: Zhe Cheng, Ruiyang Li, Xingxu Yan, Glenn Jernigan, Jingjing Shi, Michael E. Liao, Nicholas J. Hines, Chaitanya A. Gadre, Juan Carlos Idrobo, Eungkyu Lee, Karl D. Hobart, Mark S. Goorsky, Xiaoqing Pan, Tengfei Luo, Samuel Graham. Experimental observation of localized interfacial phonon modes. Nature Communications, 2021; 12 (1) DOI: 10.1038/s41467-021-27250-3 A new study … Read more

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